AMI Receives Majority Investment from THL Partners
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AMI Receives Majority Investment from THL Partners

AMI, a global leader in Dynamic Firmware, has announced a majority investment from THL Partners, a private equity firm specializing in middle market growth companies. The investment will accelerate AMIs product innovation and market expansion as it continues to provide leading technology companies with silicon level software needed for modern computing environments. AMI boasts a…

Merck KGaA, Darmstadt, Germany to Acquire UnitySC for €155 Million
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Merck KGaA, Darmstadt, Germany to Acquire UnitySC for €155 Million

Merck KGaA, Darmstadt, Germany, a leading science and technology company, has announced its intention to acquire UnitySC, a Francebased provider of metrology and defect inspection equipment for the semiconductor industry. The acquisition, valued at €155 million plus additional performancebased milestones, aims to strengthen Mercks portfolio in the semiconductor industry, particularly in the areas of Advanced…

Nearfield Instruments Secures €135 million in SeriesC Funding Round
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Nearfield Instruments Secures €135 million in SeriesC Funding Round

Nearfield Instruments, a Netherlandsbased developer of Metrology & Inspection solutions for the semiconductor industry, has successfully closed a €135 million SeriesC funding round. The funding will be used to ramp up production capacity, expand the product portfolio, and strengthen Nearfields position in the semiconductor equipment industry. The SeriesC funding round was oversubscribed and led by…

Polar Semiconductor to Expand U.S. Manufacturing Facility with $525 Million Investment
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Polar Semiconductor to Expand U.S. Manufacturing Facility with $525 Million Investment

Polar Semiconductor, a U.S.based manufacturer specializing in sensor, power, and highvoltage semiconductors, announced plans to invest approximately $525 million in expanding its Bloomington, Minnesota manufacturing facility over the next two years. The funding will double the current production capacity of semiconductor wafers and modernize the facility with new automation and AI capabilities. This investment aims…

RAAAM Memory Technologies Completes $4 Million Seed Funding Round
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RAAAM Memory Technologies Completes $4 Million Seed Funding Round

RAAAM Memory Technologies, a startup that has developed a groundbreaking onchip memory solution, announced the successful completion of a Seed financing round totaling $4 million. The companys innovative GainCell Random Access Memory (GCRAM) technology offers a more efficient alternative to industry standard SRAM technology, reducing area and power consumption significantly. The funding will be used…

NeuReality Raises $20 Million in Funding to Accelerate AI Inference Solution Deployment
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NeuReality Raises $20 Million in Funding to Accelerate AI Inference Solution Deployment

NeuReality, a technology leader specializing in re-imagining AI Inference and data center infrastructure, has secured $20 million in new funds from the European Innovation Council (EIC) Fund, Varana Capital, Cleveland Avenue, XT Hi-Tech, OurCrowd, Cardumen Capital, Glory Ventures, and Alumni Venture Group. This funding will support the company in expanding the deployment of its NR1™…

GCT Semiconductor Secures Funding for Advanced LTE, IoT, and 5G Solutions
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GCT Semiconductor Secures Funding for Advanced LTE, IoT, and 5G Solutions

GCT Semiconductor, a leading fabless designer and supplier of advanced LTE, IoT, and 5G semiconductor solutions, has announced successful funding for its continued growth and innovation in the industry. The company specializes in developing market-proven solutions for fast and reliable 4G LTE connectivity in various commercial devices, including mobile hotspots, routers, and smartphones. The funding…

Kioxia and Western Digital’s Joint Venture Receives 150 Billion Yen Subsidy for Flash Memory Production in Japan
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Kioxia and Western Digital’s Joint Venture Receives 150 Billion Yen Subsidy for Flash Memory Production in Japan

Kioxia Corporation and Western Digital Corporation have announced that their joint venture manufacturing facilities in Japan have been approved to receive an up to 150 billion yen subsidy from the Japanese government. The subsidy will support the production of the latest generation of 3D flash memory and future advanced nodes using innovative wafer bonding technology….